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Modelithics and Coilcraft Collaborate to Offer New Microwave Global Models™ for High Frequency Conical Inductor Series

Modelithics, Inc. and Coilcraft Inc. have teamed to develop two (2) new Microwave Global Models™ for the Coilcraft BCL and BCR RF and microwave inductor families. Modelithics Microwave Global Models are high-accuracy equivalent circuit models that cover an entire component series within a single model. These powerful models, unique to Modelithics, feature substrate, pad and part value scalability (or selectability), and accurately predict parasitic effects based on the model parameter settings. These features allow designers to simulate condition-specific response of their designs electronically and perform advanced analysis of their designs with efficiency and accuracy.

Find the right coils for wireless power transfer

Würth Elektronik eiSos is the manufacturer with the world’s broadest product spectrum of wireless power charging coils. Now the company provides developers with a tool to simplify selection of the right transmitter and receiver coils. Mix and Match, like the world's most precise AC loss calculator for power inductors, is another offering from the REDEXPERT Toolbox. Also like the other tools in REDEXPERT, Mix and Match shows online accessible product specifications are based on extensive electrical performance measurements of the individual modules in sample applications.

Coilcraft Introduces New RF Magnetics Lab Kit for Electrical Engineering Educators

Coilcraft has developed a new RF Magnetics Lab Kit to help educators bring practical, hands-on experience into their classrooms and instructional labs. The kit contains a selection of chip and air core inductors, LC filter modules and wideband transformers, and is offered free-of-charge to accredited Electrical Engineering programs.

According to Len Crane, Director of Technical Marketing at Coilcraft, “The addition of the RF Magnetics Lab Kit is the latest example of Coilcraft’s continuing effort to support the next generation of electrical engineers. Nearly two years ago we introduced our Power Magnetics Lab Kit and the response was tremendous. Since then, we have provided hundreds of the free kits to universities and technical schools around the globe, and the interest continues to grow.”

AVX Releases Upgraded Simulation Software For Its Advanced SMPS MLCCs

Featuring new products, updated links to the latest datasheets on the new AVX website, & product photographs designed to help engineers better visualize product selections, SpiCALCI 10 simulates performance characteristics & parameters for AVX’s advanced SMPS MLCCs

AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has released a new version of its SpiCALCI simulation software, an engineering tool that calculates performance characteristics and parameters for its advanced switch mode power supply (SMPS) multilayer ceramic capacitors (MLCCs) to help electrical design engineers select the part that will best satisfy their application criteria. SpiCALCI 10, which replaces the previous version, features all of the new SMPS MLCCs that AVX has introduced over the past 18 months (many of which are sole-sourced), in addition to updated links to the latest datasheets on the new AVX website, and product photographs designed to help engineers better visualize product selections. Other new features include an enhanced part selection process that makes it easier to find a valid part, and the option to view and save the output information that is used to generate graphs.

Altera Accelerates High-capacity FPGA Design with Quartus Prime Pro Design Software

Production Software Release Improves Design Productivity and Time-to-Market for Next-generation, High-Capacity FPGAs

San Jose, Calif., -- May 9, 2016 –Altera, now part of Intel, today announced the production release of the new Quartus® Prime Pro design software, which further accelerates FPGA design performance and design team productivity. The Quartus Prime Pro software is architected to support the next generation of high capacity, highly integrated FPGAs from Intel, which will drive innovation across the cloud, data center, Internet of Things, and the networks that connect them. The capabilities built into the latest software release accelerate large FPGA design flows by delivering unprecedented compile time improvements, versatile design entry methods and simplified intellectual property (IP) integration.