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Intel Atom Processor E3900 Series: Enabling Next Generator of Smart and Connectied IoT Devices stars

New Processor Series Moves Computing Power Nearer to Sensor, Alleviating Need to Push All Processing to Data Center

The Internet of Things (IoT) is linking billions of smart and connected devices to each other, creating a wave of change in how we live and work. The number of connected machines is expected to dramatically increase – by 2020, 50 billion devices (Cisco IBSG) will create 44 zettabytes (of 44 trillion gigabytes) of data annually, and will require much more processing power at the edge, and in the fog to network in order to maintain viability.

To support these experiences, today at IoT Solutions World Congress, Intel is announcing the latest generation of the Intel® Atom™ processors for IoT applications. The new Intel Atom processor E3900 series is designed from the ground up to support the rapid development and the growing complexity of IoT businesses. The result is a processor exceptionally capable of delivering on performance, processing and scalability.

D/A Converter Offers More Accuracy in a Smaller Footprint for Diverse Applications Ranging from Radar to Smartphone Testing

Analog Devices, Inc. (ADI) today introduced the AD9164 D/A converter that brings high-resolution radar images for designers of military and commercial radar while reducing solution component count. Additionally, for designers of precision instrumentation equipment, such as smartphone testers, the new device ensures improved accuracy as well as speed of test, contributing to faster market-ready time while significantly decreasing tester complexity and size. Thanks to its audio to 6 GHz frequency coverage, the AD9164 D/A converter moves the tester market one step closer to a universal wireless test platform.

ams launches the industry’s smallest module to offer color, ambient light and proximity sensing

ams AG (SIX: AMS), a leading provider of high performance sensors and analog ICs, today launched the smallest ever optical sensor module that delivers a combination of color (RGB), ambient light and proximity sensing, providing OEMs with design flexibility and the ability to provide a better display viewing experience.

The TMD3700 footprint, at 4.00 x 1.75mm, is the smallest footprint available in the market, and with height of 1.00mm, it’s low-profile is ideal for next-generation mobile phones with extremely tight layout and mechanical design constraints. It’s wide 45 degree field-of-view, ambient light sensing accuracy of +/-10% and operating range of 200mlux to 60Klux behind dark glass, enable smartphones to measure the surrounding light environment and automatically adjust display color and brightness for optimal viewing.

3 Steps Electrical Engineers Should Take to Obtain the Best Electronic BoM Costs

To stay competitive in today’s extremely tough markets, electrical engineers have to not only be technically adept at designing in components that give their products a competitive edge, but they also have to know the best practices in assuring that the Bill of Material (BoM) costs are as low as possible.  As the electronic component BoM cost usually represents the single largest cost element of an end-product, being good at controlling these costs can give companies in saturated markets a competitive edge. 

The field applications engineers at SemiElectronics have come up with the 3 top items that engineers should pay attention to during design process and beyond to leverage the best BoM costs possible.

Semtech’s New μClamp® 3381P Provides Superior Protection from ESD and Electrical Overstress in Industrial and Consumer Data Interfaces

The 3.3V, surge rated μClamp3381P expands the MicroClamp platform providing protection for electronic devices from surge, EFT and ESD threats

Semtech Corporation (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced the μClamp® 3381P, a single-line, 3.3V surge rated transient voltage suppression (TVS) device for safeguarding industrial and consumer interfaces against transient voltage threats.

International Standards Organizations Governing Electronic Products

With thousands of international standards organizations across the world, may aspects of life is subject to standardization, which is a good thing for most people.  Standardizing various processes and systems helps make life safer and even more productive.  The electronics industry, in particular, is subject to thousands of global standards, and hundreds of individual regulatory bodies that create, endorse, and support these standards.

As an electrical engineer working on electronic designs, it’s important to know about some of the international standards organizations that govern electronic products.  Here are some of the well-known organizations that we find engineers work with most frequently:

Microsemi Announces Imaging/Video Solution Providing a Secure, Reliable, Low Power Device for Imaging Applications

New Solution Comprised of FPGA Mezzanine Daughter Card and IP Suite

Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of a new imaging/video solution for the development of low power and reliable video processing applications. The new platform is comprised of a field programmable gate array (FPGA) mezzanine card (FMC), a comprehensive intellectual property (IP) suite and graphical user interface (GUI). The FMC plugged into the SmartFusion™2 Advanced Development Kit demonstrates Microsemi's IGLOO™2 FPGA and SmartFusion2 system-on-chip (SoC) FPGA capabilities to support a configurable and scalable camera, imaging and video designs.
Microsemi Corporation.

Z-Wave - Popular Wireless Protocol for Home Automation and Internet of Things Devices stars

As Internet of Things (IoT) becomes the new frontier in technology, all attention seems to be turning to wireless networks for home automation. One of the key players in remote home security and automation is without a doubt the Z-Wave protocol.

Z-Wave, also known as Zwave, is a communication protocol that uses RF signaling to connect and control devices used in home automation. It is a low bandwidth protocol, capable of sending short messages reliably, from one control unit to several slave nodes connected in a network. Z-Wave protocol is made of four layers:

Create 16x16 LED Displays with Flexible Reference Design

Hobbyists and makers now have more flexibility and options when developing LED signs, using the MAXREFDE99# 16x16 display reference design from Maxim.

LEDs continue to dramatically transform signage and lighting. However, often LED displays today are 8x8 and cannot communicate many international alpha-numeric characters. MAXREFDES99# integrates four MAX7219 LED drivers to provide designers a 16x16 display with 256 LEDs, allowing them to create signs in multiple languages. The MAX7219 driver simplifies the process of controlling multiple LEDs in matrix or numeric display form. For fast prototyping, software code developed for the MAXREFDES99# reference design works with both ARM mbed and Arduino platforms. Developers are encouraged to build upon and enhance the code base for more signage possibilities.

Wireless Standards Governing Internet of Things (IoT) Connectivity

Internet of Things (IoT) is an evolving field of computer, software, and hardware engineering that aims to bring interconnectivity to devices and human beings.  Since it is not a new field, several wireless standards, or protocols, of connectivity, have been developed since the beginning of IoT.  Different groups and standards try to solve various problems.  Depending on the application, which will dictate various factors such as range, data requirements, security, power demands, and battery life will determine the choice of one or a combination of technologies.  Outlined below are some of the major wireless standards that electrical engineers can use in Internet of Things electronic design.

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