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ST Microelectronics

STMicroelectronics Reveals High-Efficiency Wireless Battery-Charging Chipset for Smaller, Simpler, Sealed Wearables

A miniaturized wireless battery-charging chipset from STMicroelectronics saves space, simplifies enclosure design and sealing, and accelerates time to market for ultra-compact sports wearables, wellness monitors, medical sensors, and remote controllers. The combination of ST’s STWBC-WA charging-transmitter controller and STWLC04 wireless battery-charger receiver enables power transfers up to 1W with smaller coils than any other chipsets in the market: just 11mm diameter coils on the receive side and 20mm for the transmitter allow tinier, slimmer form factors. Power-transfer capability can be increased to 3W by using larger coils and a full-bridge circuit on the transmitter side. Eliminating any need for a conventional charging connector simplifies enclosure design and eases sealing to prevent contamination by dirt or moisture.

STMicroelectronics Reveals Ultra-Tiny Low-Dropout Regulator in Breakthrough Bumpless Chip-Scale Package

STMicroelectronics has introduced the LDBL20, a 200mA Low-Dropout (LDO) regulator in a minuscule 0.47mm x 0.47mm x 0.2mm chip-scale package that is ideal for wearable and portable devices and for flexible electronics such as multifunction connected smart cards.

The LDBL20’s bumpless STSTAMP™ package breaks through the minimum I/O-area and height limitation imposed by the diameter of traditional flip-chip solder bumps, enabling unprecedentedly small footprints and low mounted heights. The LDBL20 extends ST’s family of compact LDOs, which includes devices from 2mm x 2mm DFN to a 0.69mm x 0.69mm CSP with 300mA output.

STMicroelectronics Simplifies Design-In of State-of-the-Art Security for the IoT

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced a strong yet easy-to-use secure element to protect connected devices in the consumer and industrial Internet of Things (IoT) and to prevent cloning or copying of genuine products by ensuring authenticity.Certified to the highest security industry standards, the new STSAFE-A100 can be designed-in by developers without specialist security expertise thanks to comprehensive support ecosystem.

Consumer devices, home appliances, industrial assets, and infrastructure controllers are already connected to the internet or will be soon. Many of them are designed to be autonomous and unattended. They now need state-of-the-art electronic security to prevent hackers from counterfeiting, cloning, stealing information, or misusing the equipment. ST’s new STSAFE-A100 is a secure turnkey solution that brings the Company’s proven expertise in electronic securityfor applications such as banking, e-commerce, and identity protection to the IoT. As a secure element that provides authentication services and can be used in conjunction with an ordinary microcontroller, it features an embedded secure operating system and is certified to Common Criteria EAL5+[1], banking-level security-industry standards.

Advantages of Using Silicon Carbide in Power Electronics

The advantages of using SiC in power electronics is the focus of a large number of semiconductor news studies and reports.  These reports prove just how advantages using SiC can be when designing power electronics.

Although silicon offers numerous benefits and advantages in power MOSFETs, it also displays some limitations that are characteristic to silicon material properties.  Properties like low thermal conductivity, low bandgap energy, and limitations in switching frequencies.  Power semiconductor devices, however, that are made with silicon carbide (SiC), don’t possess those types of material limitations. 

The Road to Full Autonomous Driving: Mobileye and STMicroelectronics to Develop EyeQ®5 System-on-Chip, Targeting Sensor Fusion Central Computer for Autonomous Vehicles

5th-generation System-on-Chip, scheduled to sample in H1 2018, builds on long-standing cooperation between Mobileye and ST and market success of EyeQ technology, available now or in the near future on vehicles from
25 car manufacturers


Mobileye (NYSE:MBLY) and STMicroelectronics (NYSE:STM) today announced that the two companies are co-developing the next (5th ) generation of Mobileye’s SoC, the EyeQ® 5, to act as the central computer performing sensor fusion for Fully Autonomous Driving (FAD) vehicles starting in 2020. 

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