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RF and Microwave

Next Generation Dual-Mode Bluetooth® Audio Products from Microchip

The IS206X Family of SoC Devices Delivers Superior Sound Quality in High-End Headsets, Speakers, and Sound Bars

Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announces the next generation of dual-mode Bluetooth® audio products.  The IS206X family builds on Microchip’s successful IS202X portfolio of highly integrated system-on-a-chip (SoC) devices and modules by introducing Bluetooth Low Energy (BLE) capability.  Uniquely engineered for speakers, headsets and gaming headphones, this Flash-based platform offers ample flexibility and powerful design features, allowing audio manufacturers to easily incorporate wireless connectivity in streaming music and voice command applications.

Laird Advances Wireless Power for Connected Cars

Wireless charging advancements by global technology leader Laird (LRD: London) have the industry poised for significant growth as major automotive and mobile device manufacturers look to incorporate Laird’s technology into the daily lives of drivers and passengers.

Laird engineers have created the next generation of wireless chargers, which Guido Dornbusch, Laird’s Vice President of Product Management for Connected Vehicle Solutions, said “are highly efficient” and “have virtually no extra losses compared to cable connectors.”

Cypress Enables IoT Developers to Easily Create Tiny, Solar-Powered Sensor Beacons that Wirelessly Transmit Data on their Surrounding Environment

Cypress Semiconductor Corp. (NASDAQ: CY) today introduced a new kit with a complete reference design for a tiny, battery-free sensor beacon for a broad range of fast-growing Internet of Things (IoT) applications. The CYALKIT-E02 Solar-Powered BLE Sensor Beacon Reference Design Kit provides an easy-to-use platform for the development of a solar-powered Wireless Sensor Node (WSN) that can sense the temperature and humidity around its location and transmit the data using Bluetooth®Low Energy connectivity. The reference sensor beacon, which is 25 mm in diameter—the size of a U.S. quarter, can be placed and left to operate without maintenance for battery changes, making it ideal to monitor environmental conditions in smart home, commercial building, factory and agriculture settings. The kit is available now for pre-order for $49.

Broadcom Announces Industry’s First 60GHz Wireless Mesh Solution for Wireless Infrastructure

Broadcom Limited (NASDAQ: AVGO), a leading designer, developer and global supplier of a broad range of analog and digital semiconductor connectivity solutions, today announced the industry’s first 60GHz wireless mesh (60G WiMesh) chipset solution designed for wireless infrastructure applications including mobile backhaul and wireless access points. The chipset consists of a BCM20130 baseband SoC and a BCM20138 RF transceiver chip, both of which are implemented in standard CMOS process. Based on innovative steerable beamforming technology, the chipset provides a highly robust, cost-effective 60GHz wireless solution addressing the “last-mile problem” for wireless infrastructure.

Transceiver Provides Reliable Radio Connections and Extended Battery Life for IoT and Other Wireless Applications

NORWOOD, Mass.—Analog Devices, Inc. (ADI) today introduced a low power, high performance, radio transceiver for battery powered applications. The new transceiver enables more reliable wireless radio connections with fewer retries and packet losses as well as longer battery lifetime. The ADF7030-1 features a highly sensitive receiver and superior immunity to signal interferences as well as low power modes, including the industry’s lowest current in sleep mode. Designed with ADI’s advanced radio technology, the transceiver is ideal for users of Internet of Things (IoT) devices, smart metering, security and building automation, industrial control, and wireless sensor networks.

NXP Makes High-Performance Integrated Module Available to Accelerate Development of Solid-State RF Cooking Appliances

New plug-and-play, solid-state RF cooking module helps reduce time-to-market for appliance OEMs with easy-to-use design for intelligent cooking

NXP Semiconductors today announced new solid state RF cooking modules to accompany its popular RF cooking components portfolio. The new module is designed to help engineers rapidly build innovative RF cooking appliances that can achieve a better way of highly efficient, uniform heating, adaptability and consistency of the cooking process than conventional radiant or convection methods.

ON Semiconductor Expands Low Power Wireless Solutions Portfolio with SIGFOX and ARM for Rapid IoT Deployment

SIGFOX Ready certification for AX-SF low power radio SoC and ARM mbed support for the NCS36510 802.15.4 platform

ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has announced two major strategic developments to enable rapid deployment of Internet of Things (IoT) solutions.  Working in conjunction with SIGFOX, the world’s leading provider of dedicated connectivity for the Internet of Things (IoT), ON Semiconductor has confirmed that its AX-SFEU system-on-chip (SoC) is now fully SIGFOX Ready™ certified for optimal two-way communication in Europe with certification underway for the US. Through the AX-SF SoC, plus its accompanying library and development system, IoT developers will be able to easily use SIGFOX’s long range, two-way global IoT network - resulting in a low cost, low-power device-to-cloud connectivity solution that is highly optimized for environmental sensors, smart meters, patient monitors, security devices, streetlights and a broad spectrum of other industrial and consumer-oriented applications.

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