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Motor Control

Allegro Microsystems, LLC Introduces New Dual Full-Bridge PWM Motor Driver IC

Two Drivers in One Package Share Charge Pump Components to Save PCB Space

Allegro MicroSystems, LLC announces a new 40 V dual full-bridge driver capable of driving two DC motors with outputs rated up to 3.2 A. Allegro’s A5995 device includes fixed off-time pulse-width modulation (PWM) regulators for current control. Each DC motor can be controlled in forward, reverse, coast and brake modes with industry standard PHASE, ENABLE inputs. Fast or slow PWM current decay is selected via the MODE input. This new device is targeted at the consumer, industrial and office automation markets with end applications that include, laser, inkjet and label printers, copiers, vending, robot vacuums, and ATM machines.

ROHM's Isolated Power Supply Control ICs for Industrial Inverters

No optocoupler or auxiliary winding contributes to greater miniaturization, power savings, and reliability

ROHM has recently announced the availability of isolated flyback-type DC/DC converter control ICs for inverters in high power industrial equipment such as FA/solar inverters and power storage systems.

Isolation is almost always built into electronic equipment to provide protection against shock and damage. High voltage, high power industrial applications (including power storage systems and solar inverters which are seeing increased adoption) are no exception, requiring even more stringent reliability demands due to the harsher temperature conditions and the need for continuous, long-term operation.

Brad® M12 Power F-Coded Connectors Deliver 16.0A Current Carrying Capacity

New Cordsets and Receptacles Enable Factory Automation

Molex, LLC has introduced Brad® M12 Power F-Coded cordsets and receptacles, featuring an industry-leading current carrying capacity of up to 16.0A per pin with a blind-mate key design. While the products were developed to meet the growing power requirements of motors, solenoid-operated valves, actuation equipment and 24V DC auxiliary power systems in automation control systems, they are also well suited for LED lighting and commercial vehicle applications.

“The new Brad M12 Power interconnect system offers key advantages over existing connector interfaces that are larger and more expensive, such as M23 and MIL-C-5015 devices,” said Randy Brant, product manager, Molex. “Also, the connector’s F-Coding mating interface is expected to be adopted by the IEC Standard 61076-2-111 and has been submitted for ANSI/EIA acceptance, which will allow for an open industry connector standard. This will increase adoption among a wide array of platforms and manufacturers.”

3 Steps Electrical Engineers Should Take to Obtain the Best Electronic BoM Costs

To stay competitive in today’s extremely tough markets, electrical engineers have to not only be technically adept at designing in components that give their products a competitive edge, but they also have to know the best practices in assuring that the Bill of Material (BoM) costs are as low as possible.  As the electronic component BoM cost usually represents the single largest cost element of an end-product, being good at controlling these costs can give companies in saturated markets a competitive edge. 

The field applications engineers at SemiElectronics have come up with the 3 top items that engineers should pay attention to during design process and beyond to leverage the best BoM costs possible.

New 1700V SiC MOSFET and Control IC Evaluation Board from ROHM Semiconductor

ROHM Semiconductor has recently announced the availability of a new 1700V SiC MOSFET optimized for industrial applications, including manufacturing equipment and high-voltage general-purpose inverters.

In recent years, the growing trend to conserve energy in all areas has increased the demand for energy-saving power semiconductors, particularly for applications in the industrial sector such as general-purpose inverters and manufacturing equipment. In the majority of auxiliary power supplies, which are used to provide drive voltages for power supply circuits, control ICs, and various supplementary systems, high breakdown (1000V+) silicon MOSFETs are normally utilized. However, these high-voltage MOSFETs suffer from large conduction loss (often leading to excessive heat generation), and present problems related to mounting area and the number of external components, making it difficult to reduce system size. In response, ROHM developed low-loss SiC MOSFETs and control ICs that maximize performance while contributing to end-product miniaturization.

ON Semiconductor Introduces Automotive Power Integrated Module Solution for Next Generation Automotive BLDC Systems

ON Semiconductor (Nasdaq: ON ), has further expanded its portfolio of automotive Power Integrated Modules (PIMs) with the introduction of the STK984-190-E.Optimized for driving 3-phase brushless DC motors in modern automotive applications, this module contains six 40 V, 30 A MOSFETs configured as a three-phase bridge with an additional 40 V, 30 A high-side reverse battery protection MOSFET. The MOSFETs are mounted onto a direct bonded copper (DBC) substrate, resulting in a compact module with excellent thermal performance taking up only half of the board space used by an equivalent discrete solution.

International Standards Organizations Governing Electronic Products

With thousands of international standards organizations across the world, may aspects of life is subject to standardization, which is a good thing for most people.  Standardizing various processes and systems helps make life safer and even more productive.  The electronics industry, in particular, is subject to thousands of global standards, and hundreds of individual regulatory bodies that create, endorse, and support these standards.

As an electrical engineer working on electronic designs, it’s important to know about some of the international standards organizations that govern electronic products.  Here are some of the well-known organizations that we find engineers work with most frequently:

Murata DC-DC converter powers gate drives for optimal performance and efficiency

Murata has announced the MGJ1 1 Watt DC-DC converter series manufactured by Murata Power Solutions. These compact devices are ideal for driving high and low-side gate circuits such as those using IGBTs and SiC MOSFETs for optimal efficiency. With high isolation characteristics, up to 5.2 kVDC, the MGJ1 offers the popular nominal output voltage combinations of +15 / -5, +15 / -9, or +19 / -5 VDC. The series also offers a choice of +5, +12, or +24 VDC input.

IXYS Announces High-Speed Gate Driver for Isolated Drive Applications with up to 4KV Applications in Power Conversion and Motor Control

IXYS Corporation (NASDAQ: IXYS), a global manufacturer of power semiconductors and integrated circuits (ICs) for energy efficiency, power management, transportation, medical, and motor control applications, today announced a high-speed gate driver chipset that includes a logic interface (the IX6610) and a MOSFET/IGBT gate driver (the IX6611). The chipset is designed for pulse transformer isolated power conversion applications.

The IX6610 is a primary side logic device that implements a dual-channel bidirectional transformer interface to drive a secondary side gate driver. It is a TTL level microcontroller (MCU) interface that can transmit, through the isolation barrier, the primary side input commands, secondary side output faults, and power supply faults. With a built-in interlock and dead time control, the IX6610 can be utilized with an MCU to condition input signals and monitor system errors.

Xilinx Broadens the Zynq UltraScale+ MPSoC Family with Streamlined Dual-Core Devices

SAN JOSE, Calif., June 15, 2016 /PRNewswire/ -- Xilinx, Inc. (NASDAQ:XLNX) today announced it has added streamlined dual-core members to the Zynq® UltraScale+ MPSoC family of devices. The new dual-core "CG" family members expand the Zynq MPSoC portfolio scalability, to include dual application and real-time processor combinations. These dual-core devices add processing scalability at a lower cost entry point to the current Zynq UltraScale+ family, which offers quad ARM® Cortex®-A53s, dual Cortex-R5s, a graphics processing unit, and a video codec unit. Designers can choose from three device types within the scalable processing portfolio to address processing requirements across a breadth of markets, including motor control, sensor fusion, medical endoscopy, and handheld radios.

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