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Medical and Healthcare

Board Mount 15W to 60W AC-DC Power Supplies Have Medical and ITE Certifications

TDK Corporation announces the introduction of the TDK-Lambda KMS-A 15W to 60W board mount AC-DC medical and ITE certified power supplies. Capable of starting up at -40oC, the convection cooled units will operate in ambient temperatures of up to 80oC and are rated for full load over a -30 to 50oC range. The KMS-A series is designed for use in a wide range of medical and industrial applications, including dental, home healthcare and test and measurement.

3 Steps Electrical Engineers Should Take to Obtain the Best Electronic BoM Costs

To stay competitive in today’s extremely tough markets, electrical engineers have to not only be technically adept at designing in components that give their products a competitive edge, but they also have to know the best practices in assuring that the Bill of Material (BoM) costs are as low as possible.  As the electronic component BoM cost usually represents the single largest cost element of an end-product, being good at controlling these costs can give companies in saturated markets a competitive edge. 

The field applications engineers at SemiElectronics have come up with the 3 top items that engineers should pay attention to during design process and beyond to leverage the best BoM costs possible.

STMicroelectronics Reveals Ultra-Tiny Low-Dropout Regulator in Breakthrough Bumpless Chip-Scale Package

STMicroelectronics has introduced the LDBL20, a 200mA Low-Dropout (LDO) regulator in a minuscule 0.47mm x 0.47mm x 0.2mm chip-scale package that is ideal for wearable and portable devices and for flexible electronics such as multifunction connected smart cards.

The LDBL20’s bumpless STSTAMP™ package breaks through the minimum I/O-area and height limitation imposed by the diameter of traditional flip-chip solder bumps, enabling unprecedentedly small footprints and low mounted heights. The LDBL20 extends ST’s family of compact LDOs, which includes devices from 2mm x 2mm DFN to a 0.69mm x 0.69mm CSP with 300mA output.

New USBXpress Controller from Silicon Labs Simplifies USB Connectivity for Embedded Designs

Highly Integrated, Low-Power CP2102N Bridge Device Delivers Advanced Functionality in Small Packages for Turnkey USB Design

Silicon Labs (NASDAQ: SLAB) has added a smaller, lower-power member to its family of USBXpress™ bridge devices, providing a simpler, faster way to add Universal Serial Bus (USB) connectivity to new and legacy embedded designs. Silicon Labs’ new CP2102N USB controller eliminates complex, time-consuming firmware development and provides advanced functionality in QFN packages as small as 3 mm x 3 mm. The CP2102N device simplifies USB-to-UART connectivity and speeds time to market for a wide range of portable, power-sensitive and space-constrained applications such as USB dongles, point-of-sale (POS) terminals, data loggers, gaming controllers and personal medical devices.

International Standards Organizations Governing Electronic Products

With thousands of international standards organizations across the world, may aspects of life is subject to standardization, which is a good thing for most people.  Standardizing various processes and systems helps make life safer and even more productive.  The electronics industry, in particular, is subject to thousands of global standards, and hundreds of individual regulatory bodies that create, endorse, and support these standards.

As an electrical engineer working on electronic designs, it’s important to know about some of the international standards organizations that govern electronic products.  Here are some of the well-known organizations that we find engineers work with most frequently:

Murata DC-DC converter powers gate drives for optimal performance and efficiency

Murata has announced the MGJ1 1 Watt DC-DC converter series manufactured by Murata Power Solutions. These compact devices are ideal for driving high and low-side gate circuits such as those using IGBTs and SiC MOSFETs for optimal efficiency. With high isolation characteristics, up to 5.2 kVDC, the MGJ1 offers the popular nominal output voltage combinations of +15 / -5, +15 / -9, or +19 / -5 VDC. The series also offers a choice of +5, +12, or +24 VDC input.

Microsemi Announces Imaging/Video Solution Providing a Secure, Reliable, Low Power Device for Imaging Applications

New Solution Comprised of FPGA Mezzanine Daughter Card and IP Suite

Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of a new imaging/video solution for the development of low power and reliable video processing applications. The new platform is comprised of a field programmable gate array (FPGA) mezzanine card (FMC), a comprehensive intellectual property (IP) suite and graphical user interface (GUI). The FMC plugged into the SmartFusion™2 Advanced Development Kit demonstrates Microsemi's IGLOO™2 FPGA and SmartFusion2 system-on-chip (SoC) FPGA capabilities to support a configurable and scalable camera, imaging and video designs.
Microsemi Corporation.

Wireless Standards Governing Internet of Things (IoT) Connectivity

Internet of Things (IoT) is an evolving field of computer, software, and hardware engineering that aims to bring interconnectivity to devices and human beings.  Since it is not a new field, several wireless standards, or protocols, of connectivity, have been developed since the beginning of IoT.  Different groups and standards try to solve various problems.  Depending on the application, which will dictate various factors such as range, data requirements, security, power demands, and battery life will determine the choice of one or a combination of technologies.  Outlined below are some of the major wireless standards that electrical engineers can use in Internet of Things electronic design.

Xilinx Broadens the Zynq UltraScale+ MPSoC Family with Streamlined Dual-Core Devices

SAN JOSE, Calif., June 15, 2016 /PRNewswire/ -- Xilinx, Inc. (NASDAQ:XLNX) today announced it has added streamlined dual-core members to the Zynq® UltraScale+ MPSoC family of devices. The new dual-core "CG" family members expand the Zynq MPSoC portfolio scalability, to include dual application and real-time processor combinations. These dual-core devices add processing scalability at a lower cost entry point to the current Zynq UltraScale+ family, which offers quad ARM® Cortex®-A53s, dual Cortex-R5s, a graphics processing unit, and a video codec unit. Designers can choose from three device types within the scalable processing portfolio to address processing requirements across a breadth of markets, including motor control, sensor fusion, medical endoscopy, and handheld radios.

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