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Internet of Things (IoT)

Maxim’s Industrial IoT Reference Design Speeds Development of Authenticated Data Chains

Highly secure coprocessor supports Arduino® and ARM® mbed™ platforms, assures easy prototyping

Addressing the many issues related to system security in Industrial Internet of Things (IIoT) installations, the MAXREFDES143# embedded security reference design from Maxim Integrated Products, Inc. (NASDAQ: MXIM) provides protection against counterfeit sensor data, guaranteeing its authenticity and integrity along the entire data chain, from transducer to the cloud.

The rapid growth of IoT capabilities for industrial applications comes with legitimate concerns about data integrity, due to deliberate corruption of critical sensor data anywhere between a source and the cloud. The reference design's sophisticated architecture and components, Arduino-compatible hardware interface, and ARM mbed libraries support simplifies development of secure, uncorrupted, and authenticated sensor-to-web data. It is ideal for analog sensor node and data authentication in factory automation and industrial processing applications.

Marvell Expands Its Award-Winning SSD Product Suite by Introducing Advanced BGA SSD Controllers for New Generation of Slim, High Performance Computing Devices

Marvell's 88NV1160 doubles the performance of best-in-class DRAM-less controllers and advances the deployment of Host Memory Buffer technology

Marvell (NASDAQ:MRVL), a world leader in storage, cloud infrastructure, Internet of Things (IoT), connectivity and multimedia semiconductor solutions, today announced the expansion of its solid-state drive (SSD) portfolio to include the 88NV1160 Non-Volatile Memory (NVM) Express DRAM-less SSD controller. Marvell’s 88NV1160 DRAM-less SSD controller provides the industry’s leading performance per Watt and up to 1600MB/s read speeds. The 88NV1160 can be used in a single ball grid array (BGA) package SSD, as well as in a standalone controller in a tiny 9x10mm package which makes it compatible with M.2230 and M.2242 form factors. These features make the 88NV1160 optimized for a new generation of slim computing devices such as productivity tablets and ultrabooks. The new controller is currently available for sampling to key customers globally.

60V Synchronous Buck Battery Charger Includes Lead-Acid & Li-Ion Charge Algorithms for up to 20A Charge Current

Linear Technology Corporation introduces the LTC4013, a highly integrated, high voltage multi-chemistry synchronous step-down battery charger controller. With a wide input voltage range that spans up to 60V, the LTC4013 uses temperature-compensated 3- and 4-stage charge algorithms to efficiently charge 12V and 24V lead-acid batteries. Alternatively, the LTC4013 will charge a multicell Lithium-based battery stack with float voltages near to the input supply. Mode pins define the float voltage and charge algorithm. Charge current is precision regulated to ±5% and programmable with a single resistor up to 20A (depending on the selection of external components). The LTC4013 features user-adjustable maximum power point tracking (MPPT) circuitry that enables simple power optimization in the case of power-limited sources such as solar panels. The MPPT open-circuit method corrects for panel temperature changes without the inconvenience of adding a solar panel temperature sensor. Applications include portable medical instruments, monitoring equipment, battery backup systems, industrial handhelds, industrial lighting, military equipment, ruggedized notebooks/tablet computers, plus remote powered communication and telemetry systems.

Intersil Introduces High Efficiency, High Current Buck-Boost Regulators for Battery-Powered Portables

Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions, today announced the ISL91127 and ISL91128 high efficiency buck-boost regulators. The latest in Intersil's industry-leading buck-boost family, the new devices feature 4.5A switches, best-in-class efficiency up to 96%, and a compact footprint ideal for providing system power or powering the peripherals in battery-operated devices. They offer the industry's lowest quiescent current of 30µA for superior light load efficiency.

1A DC-DC Buck Converters from Diodes Incorporated Achieve High Efficiency Under Light-Load and Full-Load Conditions

Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic, analog and mixed-signal semiconductor markets, today announced the AP3401 and AP3428. These DC-DC step-down converters are capable of driving loads up to 1A with excellent line- and load regulation provided by a constant-frequency PWM control that requires no external compensation and so minimizes component count and material costs. Developed to meet the demands of set-top boxes, TVs, routers, Wi-Fi modules and security systems, these buck converters feature low power consumption and highly-efficient light-load operation.

ams launches the industry’s smallest module to offer color, ambient light and proximity sensing

ams AG (SIX: AMS), a leading provider of high performance sensors and analog ICs, today launched the smallest ever optical sensor module that delivers a combination of color (RGB), ambient light and proximity sensing, providing OEMs with design flexibility and the ability to provide a better display viewing experience.

The TMD3700 footprint, at 4.00 x 1.75mm, is the smallest footprint available in the market, and with height of 1.00mm, it’s low-profile is ideal for next-generation mobile phones with extremely tight layout and mechanical design constraints. It’s wide 45 degree field-of-view, ambient light sensing accuracy of +/-10% and operating range of 200mlux to 60Klux behind dark glass, enable smartphones to measure the surrounding light environment and automatically adjust display color and brightness for optimal viewing.

3 Steps Electrical Engineers Should Take to Obtain the Best Electronic BoM Costs

To stay competitive in today’s extremely tough markets, electrical engineers have to not only be technically adept at designing in components that give their products a competitive edge, but they also have to know the best practices in assuring that the Bill of Material (BoM) costs are as low as possible.  As the electronic component BoM cost usually represents the single largest cost element of an end-product, being good at controlling these costs can give companies in saturated markets a competitive edge. 

The field applications engineers at SemiElectronics have come up with the 3 top items that engineers should pay attention to during design process and beyond to leverage the best BoM costs possible.

STMicroelectronics Reveals Ultra-Tiny Low-Dropout Regulator in Breakthrough Bumpless Chip-Scale Package

STMicroelectronics has introduced the LDBL20, a 200mA Low-Dropout (LDO) regulator in a minuscule 0.47mm x 0.47mm x 0.2mm chip-scale package that is ideal for wearable and portable devices and for flexible electronics such as multifunction connected smart cards.

The LDBL20’s bumpless STSTAMP™ package breaks through the minimum I/O-area and height limitation imposed by the diameter of traditional flip-chip solder bumps, enabling unprecedentedly small footprints and low mounted heights. The LDBL20 extends ST’s family of compact LDOs, which includes devices from 2mm x 2mm DFN to a 0.69mm x 0.69mm CSP with 300mA output.

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