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Microsemi Announces Imaging/Video Solution Providing a Secure, Reliable, Low Power Device for Imaging Applications

New Solution Comprised of FPGA Mezzanine Daughter Card and IP Suite

Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of a new imaging/video solution for the development of low power and reliable video processing applications. The new platform is comprised of a field programmable gate array (FPGA) mezzanine card (FMC), a comprehensive intellectual property (IP) suite and graphical user interface (GUI). The FMC plugged into the SmartFusion™2 Advanced Development Kit demonstrates Microsemi's IGLOO™2 FPGA and SmartFusion2 system-on-chip (SoC) FPGA capabilities to support a configurable and scalable camera, imaging and video designs.
Microsemi Corporation.

Next Generation Dual-Mode Bluetooth® Audio Products from Microchip

The IS206X Family of SoC Devices Delivers Superior Sound Quality in High-End Headsets, Speakers, and Sound Bars

Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announces the next generation of dual-mode Bluetooth® audio products.  The IS206X family builds on Microchip’s successful IS202X portfolio of highly integrated system-on-a-chip (SoC) devices and modules by introducing Bluetooth Low Energy (BLE) capability.  Uniquely engineered for speakers, headsets and gaming headphones, this Flash-based platform offers ample flexibility and powerful design features, allowing audio manufacturers to easily incorporate wireless connectivity in streaming music and voice command applications.

Z-Wave - Popular Wireless Protocol for Home Automation and Internet of Things Devices stars

As Internet of Things (IoT) becomes the new frontier in technology, all attention seems to be turning to wireless networks for home automation. One of the key players in remote home security and automation is without a doubt the Z-Wave protocol.

Z-Wave, also known as Zwave, is a communication protocol that uses RF signaling to connect and control devices used in home automation. It is a low bandwidth protocol, capable of sending short messages reliably, from one control unit to several slave nodes connected in a network. Z-Wave protocol is made of four layers:

Wireless Standards Governing Internet of Things (IoT) Connectivity

Internet of Things (IoT) is an evolving field of computer, software, and hardware engineering that aims to bring interconnectivity to devices and human beings.  Since it is not a new field, several wireless standards, or protocols, of connectivity, have been developed since the beginning of IoT.  Different groups and standards try to solve various problems.  Depending on the application, which will dictate various factors such as range, data requirements, security, power demands, and battery life will determine the choice of one or a combination of technologies.  Outlined below are some of the major wireless standards that electrical engineers can use in Internet of Things electronic design.

New synchronous rectification ICs for simplicity and efficiency in SMPS applications

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) released the IR1161L and IR11688S secondary synchronous rectification (SSR) family of Controller ICs to complete Infineon’s product offerings for SMPS applications.

The IR1161L and IR11688S SSR ICs meet the new 2016 standards set by the U.S. Department of Energy and the “European Code of Conduct for Energy Efficiency in Data Centre” which demand a 1 to 3 percent efficiency improvement over previous requirements. Taking 2 percent saving as an average for new adapters, US adult notebook users alone can save 525 GWh per year – which is enough to power New York City for at least 40 days.

10 W Ac-Dc Power Supplies with Integrated USB Connectors Meet DoE Level VI and CoC Tier 2 Standards

CUI today announced a new line of DoE Level VI and CoC Tier 2 compliant wall plug-in ac-dc power supplies featuring an integrated USB connector. The 10 W SMI10-USBSWI10-N-USB and SWI10-E-USB are all designed to meet the stringent average efficiency and no load power requirements mandated by the US Department of Energy (DOE) in effect since February 2016. Any domestic or global manufacturer seeking to market their end product with an external adapter in the United States must meet the new Level VI standardswhich aim to significantly lower the amount of power consumed when the end application is not in use or is no longer connected to the system. The models also meet the European Union’s January 2018 CoC Tier 2 directive that will add additional power consumption limits at 10% load levels.

High-performance Temperature Sensor for IoT has Low Power Consumption in a Small Package

ams, a top supplier of high performance sensors and analog ICs, today launched an integrated digital temperature sensor which offers an industry-best blend of low power consumption and high precision in a little package

The 16mm x 1mm AS6200’s typical current is 6µAn at a measurement speed of 4 samples per second, and its digital measurement output signals are precise to ±04°C.

TI introduces the industry's lowest-power, low-jitter retimers for 4K UHD video and camera interface

High-performance devices resolve HDMI® 2.0 and MIPI® signal integrity issues in video, display and camera system designs

Texas Instruments (TI) (NASDAQ: TXN) today introduced three high-performance retimers which enable an extended signal range over long traces, connectors and cables without degradation of signal integrity. These devices expand TI's high-performance retimer portfolio, and support flexible, cost-optimized system design, enabling designers to speed their products to market while maintaining optimal performance. With up to 60 percent lower power consumption than competitive devices and the widest temperature range from -40C to 85C, the new retimers enable robust video and camera signal quality in equipment such as desktop and laptop PCs, mobile devices, high-definition televisions (HDTVs), and automotive infotainment systems. For more information about TI's retimer portfolio, see www.ti.com/hdmi20-pr.​

Silicon Labs USB Type-C Reference Design Gives Developers a Running Start

Complete USB Type-C™ Solution Includes Software Stacks, Schematics and Tools and Features USB Power Delivery Silicon Certified by USB-IF

Silicon Labs (NASDAQ: SLAB) has introduced a comprehensive reference design that reduces the cost and complexity of developing cables and cable adapters based on the USB Type-C™ specification. Silicon Labs’ new USB Type-C reference design features cost-effective, ultra-low-power EFM8 microcontrollers (MCUs), USB Power Delivery (PD) protocol stacks certified by the USB Implementation Forum (USB-IF), and USB Billboard Device source code.

Murata to introduce the world’s first 05025M size monolithic ceramic capacitor with a capacitance value of 1 μF

Murata Manufacturing Co., Ltd. has developed the world’s first 05025M size (0.5 × 0.25 × 0.25 mm) monolithic ceramic capacitor with a capacitance value of 1 μF (X5R characteristics, 6.3 V rated voltage), and started mass production in April 2016.

Mobile electronics such as smartphones and wearable devices are becoming smaller, thinner, and more sophisticated. With these advancements, the number of components mounted on the substrate is increasing, driving the need for even smaller and thinner components. Accordingly, Murata increased the accuracy of its proprietary elemental technology and developed the world’s first 05025M size monolithic ceramic capacitor, thereby achieving a capacitance value of 1 μF (X5R characteristics*1, 6.3 V rated voltage) in the world’s smallest component volume. With this new capacitor, Murata will again contribute to the continuing miniaturization and sophistication of mobile electronics.

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