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Consumer Electronics

ams launches the industry’s smallest module to offer color, ambient light and proximity sensing

ams AG (SIX: AMS), a leading provider of high performance sensors and analog ICs, today launched the smallest ever optical sensor module that delivers a combination of color (RGB), ambient light and proximity sensing, providing OEMs with design flexibility and the ability to provide a better display viewing experience.

The TMD3700 footprint, at 4.00 x 1.75mm, is the smallest footprint available in the market, and with height of 1.00mm, it’s low-profile is ideal for next-generation mobile phones with extremely tight layout and mechanical design constraints. It’s wide 45 degree field-of-view, ambient light sensing accuracy of +/-10% and operating range of 200mlux to 60Klux behind dark glass, enable smartphones to measure the surrounding light environment and automatically adjust display color and brightness for optimal viewing.

Find the right coils for wireless power transfer

Würth Elektronik eiSos is the manufacturer with the world’s broadest product spectrum of wireless power charging coils. Now the company provides developers with a tool to simplify selection of the right transmitter and receiver coils. Mix and Match, like the world's most precise AC loss calculator for power inductors, is another offering from the REDEXPERT Toolbox. Also like the other tools in REDEXPERT, Mix and Match shows online accessible product specifications are based on extensive electrical performance measurements of the individual modules in sample applications.

New High-Resolution Digital Biosensor for Wearable Applications

The Optoelectronics group of Vishay Intertechnology introduces a new fully integrated proximity and ambient light sensor optimized for heart rate and pulse oximetry measurements in wearable devices. The Vishay Semiconductors VCNL4020C combines an IR emitter, broad sensitivity photo diode and ambient light photo diode, a signal processing IC, and a 16-bit ADC in a compact 4.9 mm by 2.4 mm by 0.83 mm surface-mount package. The new biosensor features an interrupt function and supports I2C bus communication interface.

TI announces the only Qi-certified 15-W wireless power transmitter

Industry's most efficient 15-W solution delivers high power and fast-charge wireless charging to industrial applications

Texas Instruments (TI) (NASDAQ: TXN) today introduced the industry's first Wireless Power Consortium (WPC) v1.2 Qi-certified 15-W wireless power transmitter. The bq501210 enables 84 percent system efficiency with significantly less thermal dissipation than traditional wireless power devices. The transmitter supports multiple fast-charging protocols and offers an array of flexible and customizable features such as personal electronics, medical and space-constrained industrial applications. To learn more about the bq501210, visit www.ti.com/bq501210-pr.

TDK's subsidiary EPCOS to acquire Tronics to further grow its sensor business

TDK Corporation (“TDK”, TSE: 6762) and Tronics Microsystems SA (“Tronics”, ISIN:FR0004175099 ALTRO) jointly announced today that TDK’s wholly-owned subsidiary EPCOS AG (“EPCOS”), a leading manufacturer of electronic components, modules and systems based in Munich, Germany, and Tronics have signed a tender offer agreement pursuant to which EPCOS will launch a public tender offer for all publicly-held shares of Tronics for EUR 13.20 per share. On a fully-diluted equity value basis, the transaction represents a value of Tronics’ equity of approximately EUR 48.65 million. This represents a 78.4% premium over Tronics’ closing share price on July 7, 2016, the trading day immediately preceding the stock trading suspension, and a 62.1% premium to the volume-weighted average price during the last 60 trading days prior to this suspension.

3 Steps Electrical Engineers Should Take to Obtain the Best Electronic BoM Costs

To stay competitive in today’s extremely tough markets, electrical engineers have to not only be technically adept at designing in components that give their products a competitive edge, but they also have to know the best practices in assuring that the Bill of Material (BoM) costs are as low as possible.  As the electronic component BoM cost usually represents the single largest cost element of an end-product, being good at controlling these costs can give companies in saturated markets a competitive edge. 

The field applications engineers at SemiElectronics have come up with the 3 top items that engineers should pay attention to during design process and beyond to leverage the best BoM costs possible.

STMicroelectronics Reveals Ultra-Tiny Low-Dropout Regulator in Breakthrough Bumpless Chip-Scale Package

STMicroelectronics has introduced the LDBL20, a 200mA Low-Dropout (LDO) regulator in a minuscule 0.47mm x 0.47mm x 0.2mm chip-scale package that is ideal for wearable and portable devices and for flexible electronics such as multifunction connected smart cards.

The LDBL20’s bumpless STSTAMP™ package breaks through the minimum I/O-area and height limitation imposed by the diameter of traditional flip-chip solder bumps, enabling unprecedentedly small footprints and low mounted heights. The LDBL20 extends ST’s family of compact LDOs, which includes devices from 2mm x 2mm DFN to a 0.69mm x 0.69mm CSP with 300mA output.

New USBXpress Controller from Silicon Labs Simplifies USB Connectivity for Embedded Designs

Highly Integrated, Low-Power CP2102N Bridge Device Delivers Advanced Functionality in Small Packages for Turnkey USB Design

Silicon Labs (NASDAQ: SLAB) has added a smaller, lower-power member to its family of USBXpress™ bridge devices, providing a simpler, faster way to add Universal Serial Bus (USB) connectivity to new and legacy embedded designs. Silicon Labs’ new CP2102N USB controller eliminates complex, time-consuming firmware development and provides advanced functionality in QFN packages as small as 3 mm x 3 mm. The CP2102N device simplifies USB-to-UART connectivity and speeds time to market for a wide range of portable, power-sensitive and space-constrained applications such as USB dongles, point-of-sale (POS) terminals, data loggers, gaming controllers and personal medical devices.

Semtech’s New μClamp® 3381P Provides Superior Protection from ESD and Electrical Overstress in Industrial and Consumer Data Interfaces

The 3.3V, surge rated μClamp3381P expands the MicroClamp platform providing protection for electronic devices from surge, EFT and ESD threats

Semtech Corporation (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced the μClamp® 3381P, a single-line, 3.3V surge rated transient voltage suppression (TVS) device for safeguarding industrial and consumer interfaces against transient voltage threats.

International Standards Organizations Governing Electronic Products

With thousands of international standards organizations across the world, may aspects of life is subject to standardization, which is a good thing for most people.  Standardizing various processes and systems helps make life safer and even more productive.  The electronics industry, in particular, is subject to thousands of global standards, and hundreds of individual regulatory bodies that create, endorse, and support these standards.

As an electrical engineer working on electronic designs, it’s important to know about some of the international standards organizations that govern electronic products.  Here are some of the well-known organizations that we find engineers work with most frequently:

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