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Communication and Telecom

Murata launches ultra compact low cost standalone LoRa module

Murata today announced the launch of a compact low-cost low power wide area network (LPWAN) wireless module that supports the LoRaWAN long range wireless protocol. This standalone compact module measures just 12.5 x 11.6 x 1.76 mm, is constructed in a metal shielded package and comprises a Semtech SX1276 ultra long range spread spectrum wireless transceiver and an STMicro STM32L0 series ARM Cortex M0+ 32 bit microcontroller (MCU). An integrated TCXO that has robust low drift thermal characteristics provides an accurate clock source for the RF transceiver.

Wireless Standards Governing Internet of Things (IoT) Connectivity

Internet of Things (IoT) is an evolving field of computer, software, and hardware engineering that aims to bring interconnectivity to devices and human beings.  Since it is not a new field, several wireless standards, or protocols, of connectivity, have been developed since the beginning of IoT.  Different groups and standards try to solve various problems.  Depending on the application, which will dictate various factors such as range, data requirements, security, power demands, and battery life will determine the choice of one or a combination of technologies.  Outlined below are some of the major wireless standards that electrical engineers can use in Internet of Things electronic design.

Two New Series of SMT Gas Discharge Tubes from Littelfuse Offer Higher Surge Ratings in Smaller Footprints

Ultra-low capacitance makes them ideal for G.Fast modems and other high-speed applications

Littelfuse, Inc., the global leader in circuit protection, has introduced two new series of miniature surface-mount two-terminal Gas Discharge Tubes (GDTs) designed to protect sensitive electronics from low-to-medium level lightning-induced surges and other voltage transients. The 3.5mm diameter size of the CG6 Series Miniature SMT GDT makes it the world’s smallest two-electrode single chamber GDT available on the market. It is also the first SMT GDT with two square terminals that offers 3kA (8/20µs), surge withstand capability (10 shots).

IDT Introduces Latest Generation Highly Integrated, Programmable and Scalable Power Management IC

The Flexible P9180A PMIC Delivers Highly Scalable Power for a Variety of Applications through IDT’s Innovative DPU Technology

Integrated Device Technology, Inc. (IDT) (NASDAQ: IDTI) today announced general availability of the IDT® P9180A, a next-generation, highly integrated scalable power management integrated circuit (PMIC) targeting a broad array of applications in the IoT, server, micro-server, storage, embedded and industrial market segments. The programmable P9180A PMIC delivers flexibility and ease of use while supporting the varying power requirements of multiple market segments and meeting the power needs of today’s SoCs, FPGAs, and ASICs.

The P9180A achieves its power scalability through IDT’s innovative distributed power architecture, which enables engineers to scale power beyond the P9180A’s standalone capacity by adding distributed power units (DPUs) to the system. The IDT P9148 DPU communicates using a proprietary two-wire interface design, greatly reducing power subsystem complexity and enabling system designers to optimally distribute power resources throughout the system. This distribution helps engineers avoid or resolve the EMI, thermal and signal integrity issues often associated with PMICs.

Bourns Introduces New G.Fast and LAN Transformers for DSL and Ethernet/PoE Applications

Bourns, Inc., a leading manufacturer and supplier of electronic components, today introduced two new transformer products -- a G.Fast Transformer, Model SM51430EL, and a LAN 10/100/1000 Base-T Transformer, Model SM51625EL. Standards-based, Bourns designed its latest G.Fast transformers to meet IEC 60950-1, Functional Grade of Insulation and its LAN transformers to comply with IEEE802.3 standards.

Broadcom Announces Industry’s First 60GHz Wireless Mesh Solution for Wireless Infrastructure

Broadcom Limited (NASDAQ: AVGO), a leading designer, developer and global supplier of a broad range of analog and digital semiconductor connectivity solutions, today announced the industry’s first 60GHz wireless mesh (60G WiMesh) chipset solution designed for wireless infrastructure applications including mobile backhaul and wireless access points. The chipset consists of a BCM20130 baseband SoC and a BCM20138 RF transceiver chip, both of which are implemented in standard CMOS process. Based on innovative steerable beamforming technology, the chipset provides a highly robust, cost-effective 60GHz wireless solution addressing the “last-mile problem” for wireless infrastructure.

Altera Accelerates High-capacity FPGA Design with Quartus Prime Pro Design Software

Production Software Release Improves Design Productivity and Time-to-Market for Next-generation, High-Capacity FPGAs

San Jose, Calif., -- May 9, 2016 –Altera, now part of Intel, today announced the production release of the new Quartus® Prime Pro design software, which further accelerates FPGA design performance and design team productivity. The Quartus Prime Pro software is architected to support the next generation of high capacity, highly integrated FPGAs from Intel, which will drive innovation across the cloud, data center, Internet of Things, and the networks that connect them. The capabilities built into the latest software release accelerate large FPGA design flows by delivering unprecedented compile time improvements, versatile design entry methods and simplified intellectual property (IP) integration.

New 600 V SiHJ8N60E and 650 V SiHJ6N65E and SiHJ7N65E E Series MOSFETs in PowerPAK® SO-8L Increase Reliability and Reduce Package Inductance

Vishay Intertechnology announces that it has extended its offering of 600 V and 650 V E Series power MOSFETs with three new n-channel devices in the compact PowerPAK SO-8L package. Providing space-saving alternatives to MOSFETs in the TO-252 (DPAK) package, the Vishay Siliconix 600 V SiHJ8N60E and 650 V SiHJ6N65E and SiHJ7N65E increase reliability and provide reduced package inductance for lighting, industrial, telecom, computing, and consumer applications.
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