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Communication and Telecom

40A µModule Regulator with 3D Stacked-Inductor Packaging Enhances Thermal Conduction for Cooler Operation

Linear Technology Corporation introduces the LTM4636, a 40A step-down µModule® switching regulator with 3D construction for quicker heat dissipation and cooler operation in a small package. By stacking its inductor on top of a 16mm x 16mm BGA package, the LTM4636 benefits from the exposed inductor as a heat sink, permitting direct contact with airflow from any direction to cool the device. The LTM4636 delivers 40W (12VIN, 1VOUT, 40A, 200LFM) with only 40°C rise over ambient temperature. Full-power 40W is delivered up to 83°C ambient and half-power 20W is supported at 110°C ambient.

Future-Ready Wi-Fi and Bluetooth Capabilities in Certified Module Solutions from Laird

Laird’s new 60 Series of certified 802.11ac 2x2 MU-MIMO Wi-Fi + Bluetooth v4.2 modules provide unmatched connectivity and performance in challenging wireless environments

A new series of advanced Wi-Fi and Bluetooth modules that are designed to help developers and inventors connect billions of objects to the Enterprise Internet of Things (EIoT), especially in challenging RF environments like hospitals and large industrial facilities, was announced today by global wireless technology leader Laird (LRD: London) during Electronica 2016 in Munich, Germany.

Fairchild Launches SuperFET III MOSFET Family with Best-in-Class Efficiency and Reliability

Better Efficiency, EMI and Ruggedness Make SuperFET III MOSFETs Ideal for High-Performance Products with Demanding Robustness and Reliability Requirements

Fairchild Semiconductor, now part of ON Semiconductor), today introduced its SuperFET® III family of 650V N-channel MOSFETs, the company’s new generation of MOSFETs that meet the higher power density, system efficiency and exceptional reliability requirements of the latest telecom, server, electric vehicle (EV) charger and solar products.

The SuperFET III MOSFET family combines best-in-class reliability, low EMI, excellent efficiency and superior thermal performance to make it an ideal choice for high-performance applications. Complementing its performance characteristics, its broad range of package options gives product designers greater flexibility, particularly with size constrained designs.

New Line of USB 2.0 and 3.0 Connectors Expands CUI’s Interconnect Portfolio

CUI’s Components Group today announced an expansion to its existing portfolio of power, audio and signal connectors with the addition of a USB product line. The new connector family incorporates USB 2.0 and 3.0 connectors available in Type A, Type B, Micro AB, Micro B, Mini AB and Mini B USB versions. Able to support data rates up to 5 Gbps in USB 3.0 models, the new product family is ideal for a variety of I/O applications in consumer and portable electronic devices, including mobile computing equipment, digital audio devices and high volume storage products.

Broadcom First to Deliver 64 Ports of 100GE with Tomahawk II 6.4Tbps Ethernet Switch

Data center networks gain powerful solution that provides advanced flow processing engines and instrumentation for network analytics

Broadcom Limited (NASDAQ: AVGO), today announced immediate availability of its new family of switches optimized for cloud-scale data centers deploying high density 100G switching solutions. Building on the widely deployed StrataXGS® Tomahawk® and Trident™ switch products, the new StrataXGS Tomahawk II Switch Series is the highest performance Ethernet switch available today, supporting up to 64 ports 100GE or 128 ports of 50GE with SDN-optimized packet switch engines operating at 6.4 Terabits per second.

Intel Atom Processor E3900 Series: Enabling Next Generator of Smart and Connectied IoT Devices stars

New Processor Series Moves Computing Power Nearer to Sensor, Alleviating Need to Push All Processing to Data Center

The Internet of Things (IoT) is linking billions of smart and connected devices to each other, creating a wave of change in how we live and work. The number of connected machines is expected to dramatically increase – by 2020, 50 billion devices (Cisco IBSG) will create 44 zettabytes (of 44 trillion gigabytes) of data annually, and will require much more processing power at the edge, and in the fog to network in order to maintain viability.

To support these experiences, today at IoT Solutions World Congress, Intel is announcing the latest generation of the Intel® Atom™ processors for IoT applications. The new Intel Atom processor E3900 series is designed from the ground up to support the rapid development and the growing complexity of IoT businesses. The result is a processor exceptionally capable of delivering on performance, processing and scalability.

Wide input Range 15W DC-DC Converters Have Six-Sided Shielding

TDK Corporation announces the introduction of the TDK-Lambda 15W CCG15S series of DC-DC converters, further extending the CCG product family. Operating over a 4:1 input range, these highly efficiency products are enclosed in a 1 inch by 1 inch six-sided shielded metal case. Applications include telecommunications, process control, broadcast, battery powered and test and measurement equipment.

Mesh Networking Module from Silicon Labs Simplifies Thread and ZigBee Connectivity

Silicon Labs (NASDAQ: SLAB) has introduced a new family of Wireless Gecko modules focused on mesh networking applications with support for best-in-class ZigBee® and Thread software. Silicon Labs’ new MGM111 module is the first in this comprehensive family of multiprotocol modules based on the Mighty Gecko system-on-chip (SoC) device. The MGM111 module is supported by Silicon Labs’ reliable, secure and flexible mesh protocol stacks and the industry’s most advanced wireless software development tools. The module’s combination of onboard stacks, antenna options and RF regulatory certifications helps developers reduce cost, complexity and time to market for an array of mesh networking applications including home and building automation, connected lighting, smart metering, security systems and other IoT platforms.

Renesas Electronics Introduces Low-Power RL78/G11 Microcontrollers to Accelerate Prototyping and Development for Compact Sensor Hub Applications in Industrial, Healthcare and Agricultural Industries

General-Purpose Microcontrollers Equipped in 24-Pin Compact Package Support Up to 13 Sensors

Renesas Electronics America Inc., a premier supplier of advanced semiconductor solutions, today announced the RL78/G11 Group of microcontrollers (MCUs), a group of small-package, low-power MCUs that will enable users to easily and more quickly prototype and develop systems that support low-power sensor hubs and sensor application systems. Designed to connect to multiple sensors and convert the sensor output signals to digital data, these compact sensor hubs are used in a wide range of applications, such as computer operating environment monitoring for data center thermocouples in the industrial area, wearable health management devices in the healthcare field, and environmental sensing in greenhouses and factory farms in the agricultural industry.

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