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Automotive and Transportation

Allegro MicroSystems, LLC Introduces New Buck/Boost Controller With Integrated Buck MOSFET

Allegro MicroSystems, LLC introduces a new automotive AEC-Q100 qualified power management IC. The A4450 can implement either a buck or buck/boost regulator to efficiently convert automotive battery voltages into a tightly regulated voltage, with seamless transition between the buck and boost modes. This new device is targeted at the automotive, industrial and instrumentation markets with end applications to include infotainment, instrument clusters, telematics, amplifiers, and control modules.

TDK's subsidiary EPCOS to acquire Tronics to further grow its sensor business

TDK Corporation (“TDK”, TSE: 6762) and Tronics Microsystems SA (“Tronics”, ISIN:FR0004175099 ALTRO) jointly announced today that TDK’s wholly-owned subsidiary EPCOS AG (“EPCOS”), a leading manufacturer of electronic components, modules and systems based in Munich, Germany, and Tronics have signed a tender offer agreement pursuant to which EPCOS will launch a public tender offer for all publicly-held shares of Tronics for EUR 13.20 per share. On a fully-diluted equity value basis, the transaction represents a value of Tronics’ equity of approximately EUR 48.65 million. This represents a 78.4% premium over Tronics’ closing share price on July 7, 2016, the trading day immediately preceding the stock trading suspension, and a 62.1% premium to the volume-weighted average price during the last 60 trading days prior to this suspension.

3 Steps Electrical Engineers Should Take to Obtain the Best Electronic BoM Costs

To stay competitive in today’s extremely tough markets, electrical engineers have to not only be technically adept at designing in components that give their products a competitive edge, but they also have to know the best practices in assuring that the Bill of Material (BoM) costs are as low as possible.  As the electronic component BoM cost usually represents the single largest cost element of an end-product, being good at controlling these costs can give companies in saturated markets a competitive edge. 

The field applications engineers at SemiElectronics have come up with the 3 top items that engineers should pay attention to during design process and beyond to leverage the best BoM costs possible.

ON Semiconductor Introduces Automotive Power Integrated Module Solution for Next Generation Automotive BLDC Systems

ON Semiconductor (Nasdaq: ON ), has further expanded its portfolio of automotive Power Integrated Modules (PIMs) with the introduction of the STK984-190-E.Optimized for driving 3-phase brushless DC motors in modern automotive applications, this module contains six 40 V, 30 A MOSFETs configured as a three-phase bridge with an additional 40 V, 30 A high-side reverse battery protection MOSFET. The MOSFETs are mounted onto a direct bonded copper (DBC) substrate, resulting in a compact module with excellent thermal performance taking up only half of the board space used by an equivalent discrete solution.

International Standards Organizations Governing Electronic Products

With thousands of international standards organizations across the world, may aspects of life is subject to standardization, which is a good thing for most people.  Standardizing various processes and systems helps make life safer and even more productive.  The electronics industry, in particular, is subject to thousands of global standards, and hundreds of individual regulatory bodies that create, endorse, and support these standards.

As an electrical engineer working on electronic designs, it’s important to know about some of the international standards organizations that govern electronic products.  Here are some of the well-known organizations that we find engineers work with most frequently:

Microsemi Announces Imaging/Video Solution Providing a Secure, Reliable, Low Power Device for Imaging Applications

New Solution Comprised of FPGA Mezzanine Daughter Card and IP Suite

Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of a new imaging/video solution for the development of low power and reliable video processing applications. The new platform is comprised of a field programmable gate array (FPGA) mezzanine card (FMC), a comprehensive intellectual property (IP) suite and graphical user interface (GUI). The FMC plugged into the SmartFusion™2 Advanced Development Kit demonstrates Microsemi's IGLOO™2 FPGA and SmartFusion2 system-on-chip (SoC) FPGA capabilities to support a configurable and scalable camera, imaging and video designs.
Microsemi Corporation.

Micron Introduces Industry's Best-in-Class SLC NAND Flash for IoT and Automotive

New high-performance NAND Flash enables faster, more reliable, secure and cost-effective data storage

Micron Technology, Inc. (NASDAQ:MU), today announced its newest embedded SLC NAND Flash optimized for the next generation of Internet of Things (IoT) and automotive applications. Available with differing interfaces to accommodate design,  Micron's second generation Serial (SPI) NAND and fifth generation parallel SLC NAND, offers the industry's best-in-class reliability1 and read and program performance, ease of design and advanced security features.

2A, 2MHz, 28V Boost/SEPIC/Inverting DC/DC Converter with IQ = 6µA

Linear Technology Corporation announces the LT8335, a current mode, 2MHz step-up DC/DC converter with an internal 2A, 28V switch. It operates from an input voltage range of 3V to 25V, suitable for applications with input sources ranging from a single-cell Li-Ion to automotive inputs. The LT8335 can be configured as either a boost, SEPIC or an inverting converter. It utilizes a fixed 2MHz switching frequency, enabling designers to minimize external component sizes and avoid critical frequency bands, such as AM radio. Burst Mode® operation reduces quiescent current to only 6µA while keeping output ripple below 15mVP-P. The combination of a 3mm x 2mm DFN package and tiny externals ensures a very compact footprint while minimizing solution cost.

Laird Advances Wireless Power for Connected Cars

Wireless charging advancements by global technology leader Laird (LRD: London) have the industry poised for significant growth as major automotive and mobile device manufacturers look to incorporate Laird’s technology into the daily lives of drivers and passengers.

Laird engineers have created the next generation of wireless chargers, which Guido Dornbusch, Laird’s Vice President of Product Management for Connected Vehicle Solutions, said “are highly efficient” and “have virtually no extra losses compared to cable connectors.”

Intersil's 12-Cell Li-ion Battery Pack Monitor Safeguards Hybrid and Electric Vehicle Battery Systems

Automotive-grade ISL78610 battery monitor and ISL78600 battery manager enable ASIL-D compliant systems

Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions, today announced the ISL78610 12-cell lithium-ion (Li-ion) battery pack monitor. The device provides cell balancing and accurate voltage and temperature monitoring to safeguard Li-ion battery packs in hybrid electric vehicles, plug-in hybrid electric vehicles, and electric vehicles. System designers can use the ISL78610 as a standalone battery-pack monitor or as a redundant back-up device when combined with the high accuracy ISL78600 multi-cell battery manager. This powerful combination enables automobile manufacturers to achieve the higher ISO 26262 automotive safety integrity level (ASIL) D rating.

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