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Fairchild Launches SuperFET III MOSFET Family with Best-in-Class Efficiency and Reliability

Better Efficiency, EMI and Ruggedness Make SuperFET III MOSFETs Ideal for High-Performance Products with Demanding Robustness and Reliability Requirements

Fairchild Semiconductor, now part of ON Semiconductor), today introduced its SuperFET® III family of 650V N-channel MOSFETs, the company’s new generation of MOSFETs that meet the higher power density, system efficiency and exceptional reliability requirements of the latest telecom, server, electric vehicle (EV) charger and solar products.

The SuperFET III MOSFET family combines best-in-class reliability, low EMI, excellent efficiency and superior thermal performance to make it an ideal choice for high-performance applications. Complementing its performance characteristics, its broad range of package options gives product designers greater flexibility, particularly with size constrained designs.

Quasi-Resonant PWM Controller from Diodes Incorporated Optimizes Efficiency in Power Adapter Applications

Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic, analog and mixed-signal semiconductor markets, today introduced the AP3301. This quasi-resonant (QR) PWM controller enables the implementation of high-performance, cost-effective power supplies that are capable of meeting DOE6/COC Tier 2 efficiency requirements at all load levels. Targeting the key market of AC-DC adapters for set-top box and gaming console applications, this controller also meets the auxiliary power requirements of ATX/BTX computer motherboards and is suited for use in open-frame switching power supplies.

Cypress Enables Secure, High-Speed Networking for Automotive Body Electronics with New Traveo MCU Solutions

Cypress Semiconductor Corp. (NASDAQ: CY) today announced it is sampling new devices in its single-power-supply Traveo™ automotive microcontroller (MCU) family that provide secure, high-speed networking for body electronics applications. The new S6J342xxx series supports the Controller Area Network Flexible Data-rate (CAN FD) standard for high-speed, in-vehicle networking, enabling large amounts of data to be exchanged between each CAN node. The MCUs address the critical need to secure data on in-vehicle networks with enhanced Secure Hardware Extension (eSHE) support, preventing unauthorized connections to electronic control units (ECUs). The new Traveo series continues Cypress’s expansion of its broad automotive portfolio that includes MCUs, wireless radios, memories, capacitive-touch solutions and Power Management ICs (PMICs).

New Line of USB 2.0 and 3.0 Connectors Expands CUI’s Interconnect Portfolio

CUI’s Components Group today announced an expansion to its existing portfolio of power, audio and signal connectors with the addition of a USB product line. The new connector family incorporates USB 2.0 and 3.0 connectors available in Type A, Type B, Micro AB, Micro B, Mini AB and Mini B USB versions. Able to support data rates up to 5 Gbps in USB 3.0 models, the new product family is ideal for a variety of I/O applications in consumer and portable electronic devices, including mobile computing equipment, digital audio devices and high volume storage products.

Broadcom First to Deliver 64 Ports of 100GE with Tomahawk II 6.4Tbps Ethernet Switch

Data center networks gain powerful solution that provides advanced flow processing engines and instrumentation for network analytics

Broadcom Limited (NASDAQ: AVGO), today announced immediate availability of its new family of switches optimized for cloud-scale data centers deploying high density 100G switching solutions. Building on the widely deployed StrataXGS® Tomahawk® and Trident™ switch products, the new StrataXGS Tomahawk II Switch Series is the highest performance Ethernet switch available today, supporting up to 64 ports 100GE or 128 ports of 50GE with SDN-optimized packet switch engines operating at 6.4 Terabits per second.

Analog Devices and Dell EMC Collaborate on IoT Solution for Monitoring Real-Time Health and Safety of First Responders in Dangerous Conditions

Analog Devices, Inc. and Dell EMC today unveiled a proof of concept (POC) for an Internet of Things (IoT) solution that tracks the health and location of first responders. The POC IoT solution is designed to improve the safety and effectiveness of first responders when involved in an emergency situation, especially those in harsh environments. According to the National Fire Protection Association, more than 60,000 fire fighter injuries in North America alone are reported annually, of which 25 percent are as a result of overexertion or strain.

The POC IoT solution tracks the location and vital signs of first responders at all times in or outside of buildings. A smart, wearable sensor-equipped vest is worn by personnel to monitor useful health metrics including breathing rate, breathing volume, and heart rate. A connected boot tracks location and movement. By identifying potential worker health issues immediately and tracking lone workers via these metrics, emergency teams can be healthier, safer, and more efficient. All the relevant vest and boot data are collected by an edge gateway device and relayed via a mobile network to a private, secure cloud. The results from multiple personnel are then displayed on a portal via a dashboard for access by control teams who may be at the emergency site or in a central control location. The data is analyzed to monitor worker health and enable a fast response to ensure their safety. Historical analysis of vital signs over multiple responses safeguards continued welfare of safety personnel.

Intel Atom Processor E3900 Series: Enabling Next Generator of Smart and Connectied IoT Devices stars

New Processor Series Moves Computing Power Nearer to Sensor, Alleviating Need to Push All Processing to Data Center

The Internet of Things (IoT) is linking billions of smart and connected devices to each other, creating a wave of change in how we live and work. The number of connected machines is expected to dramatically increase – by 2020, 50 billion devices (Cisco IBSG) will create 44 zettabytes (of 44 trillion gigabytes) of data annually, and will require much more processing power at the edge, and in the fog to network in order to maintain viability.

To support these experiences, today at IoT Solutions World Congress, Intel is announcing the latest generation of the Intel® Atom™ processors for IoT applications. The new Intel Atom processor E3900 series is designed from the ground up to support the rapid development and the growing complexity of IoT businesses. The result is a processor exceptionally capable of delivering on performance, processing and scalability.

Allegro Microsystems, LLC Introduces New Dual Full-Bridge PWM Motor Driver IC

Two Drivers in One Package Share Charge Pump Components to Save PCB Space

Allegro MicroSystems, LLC announces a new 40 V dual full-bridge driver capable of driving two DC motors with outputs rated up to 3.2 A. Allegro’s A5995 device includes fixed off-time pulse-width modulation (PWM) regulators for current control. Each DC motor can be controlled in forward, reverse, coast and brake modes with industry standard PHASE, ENABLE inputs. Fast or slow PWM current decay is selected via the MODE input. This new device is targeted at the consumer, industrial and office automation markets with end applications that include, laser, inkjet and label printers, copiers, vending, robot vacuums, and ATM machines.

Introducing industry's first fully integrated DDR memory power solution

TI's 4-A synchronous DC/DC buck converter simplifies design and shrinks system size in automotive and industrial applications

Texas Instruments (TI) (NASDAQ: TXN) today introduced the industry's first fully integrated power management solution for double date rate (DDR)2, DDR3 and DDR3L memory subsystems in automotive and industrial applications. The TPS54116-Q1 DC/DC buck converter is a 2.95-V to 6-V input, 4-A synchronous step-down converter with a 1-A peak sink/source DDR termination and buffered reference that reduces system size by up to 50 percent compared to discrete implementations.

MATEnet Modular and Scalable Connectors for Automotive Ethernet

Infotainment solution designed to deliver top performance for harsh automotive environment.

TE Connectivity (TE), a world leader in connectivity and sensor solutions, today announced its new MATEnet modular and scalable connector for automotive Ethernet. The new solution provides the performance needed to transmit large volumes of data for transmit large volumes of data for infotainment, on-board diagnostics and more in vehicles.

TE’s MATEnet modular and scalable connector is designed for the harsh automotive environment and can transmit up to 1Gbit/s. Based on miniaturized standard automotive terminals, such as NanoMQS, Generation50, MCON 050 and 0.50 Series, MATEnet connectors represent a global terminal platform. In addition, they can be used with twisted pair (TP), unshielded twisted pair (UTP) and shielded twisted pair (STP) types of cable for Ethernet applications.