November 14, 2016
Integrated Device Technology, Inc. (IDT) (NASDAQ: IDTI) announced today that it has signed a global franchise agreement with Future Electronics. Under the agreement, Montreal-based Future Electronics becomes IDT’s newest distributor of products through its offices in 44 countries spanning the globe.
“Future Electronics is a global leader in electronics distribution, with the technical expertise to demonstrate the value IDT’s system solutions brings to a wide range of advanced applications,” said Jennifer Bleakney, vice president of sales distribution and channel marketing at...
November 10, 2016
Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions, today introduced two new USB-C™ buck-boost battery chargers that support bidirectional power delivery in ultrabooks, tablets, power banks and other mobile products. The single-chip ISL9238 and ISL9238A battery chargers replace competitive two-chip solutions to reduce customer bill of materials (BOM) costs by up to 40%. Both ICs employ Intersil's patented R3™ modulation technology to extend battery life and deliver acoustic noise-free operation, superior light-load efficiency...
November 09, 2016
Laird’s new 60 Series of certified 802.11ac 2x2 MU-MIMO Wi-Fi + Bluetooth v4.2 modules provide unmatched connectivity and performance in challenging wireless environments
A new series of advanced Wi-Fi and Bluetooth modules that are designed to help developers and inventors connect billions of objects to the Enterprise Internet of Things (EIoT), especially in challenging RF environments like hospitals and large industrial facilities, was announced today by global wireless technology leader Laird (LRD: London) during Electronica 2016 in Munich, Germany.
November 09, 2016
KEMET Corporation (NYSE: KEM), a leading global supplier of electronic components, announced today that it is introducing expanded versions of its commercial and automotive grade High Voltage C0G Ceramic capacitors to meet the needs of the growing Wide Band Gap semiconductor trend. KEMET is now offering case sizes 2824, 3040, 3640, and 4540 to increase capacitance up to 150 nF with voltages up to 2,000 V. With a low profile and aspect ratio, these devices exhibit low inductance and ESR...
November 04, 2016
Around 60 electronic control units communicate with each other in vehicles today via the Controller Area Network (CAN). The need for in-vehicle communication is growing as the amount of networking increases and more comfort and automation are implemented. The new protocol variant CAN FD (CAN Flexible Data-rate) allows a higher data bandwidth and transmission speed. This saves time in programming, in tests and diagnostic routines as well as for software updates over the air (SOTA).
With its TLE925x CAN FD transceivers...
October 25, 2016
Analog Devices, Inc. and Dell EMC today unveiled a proof of concept (POC) for an Internet of Things (IoT) solution that tracks the health and location of first responders. The POC IoT solution is designed to improve the safety and effectiveness of first responders when involved in an emergency situation, especially those in harsh environments. According to the National Fire Protection Association, more than 60,000 fire fighter injuries in North America alone are reported annually, of which 25 percent are...
October 25, 2016
New Processor Series Moves Computing Power Nearer to Sensor, Alleviating Need to Push All Processing to Data Center
The Internet of Things (IoT) is linking billions of smart and connected devices to each other, creating a wave of change in how we live and work. The number of connected machines is expected to dramatically increase – by 2020, 50 billion devices (Cisco IBSG) will create 44 zettabytes (of 44 trillion gigabytes) of data annually, and will require much more processing power...
October 18, 2016
CUI’s Components Group today announced an expansion to its existing portfolio of power, audio and signal connectors with the addition of a USB product line. The new connector family incorporates USB 2.0 and 3.0 connectors available in Type A, Type B, Micro AB, Micro B, Mini AB and Mini B USB versions. Able to support data rates up to 5 Gbps in USB 3.0 models, the new product family is ideal for a variety of I/O applications in consumer and...
October 11, 2016
Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic, analog and mixed-signal semiconductor markets, today introduced the AP3301. This quasi-resonant (QR) PWM controller enables the implementation of high-performance, cost-effective power supplies that are capable of meeting DOE6/COC Tier 2 efficiency requirements at all load levels. Targeting the key market of AC-DC adapters for set-top box and gaming console applications, this controller also meets the auxiliary power requirements of...